Volume 5 Issue 1
Feb.  2020
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Na Zhang, Zhuo Li, Yanan Xiao, Zheng Pan, Puyou Jia, Guodong Feng, Caiying Bao, Yonghong Zhou, Lilong Hua. Lignin-based phenolic resin modified with whisker silicon and its ap-plication[J]. Journal of Bioresources and Bioproducts, 2020, 5(1): 67-77. doi: 10.1016/j.jobab.2020.03.008
Citation: Na Zhang, Zhuo Li, Yanan Xiao, Zheng Pan, Puyou Jia, Guodong Feng, Caiying Bao, Yonghong Zhou, Lilong Hua. Lignin-based phenolic resin modified with whisker silicon and its ap-plication[J]. Journal of Bioresources and Bioproducts, 2020, 5(1): 67-77. doi: 10.1016/j.jobab.2020.03.008

Lignin-based phenolic resin modified with whisker silicon and its ap-plication

doi: 10.1016/j.jobab.2020.03.008
Funds:

Key R & D Plan of the 13th Five-Year Plan 2017YFD0601003

Key projects funded by the Chinese Academy of Forest 2017YFD0601003

Innovation Project of Institute of Forestry and Chemical Industry LHSXKQ11

More Information
  • Corresponding author: E-mail address: zhlh990907@sina.com (L. Hua)
  • Received Date: 2019-07-10
  • Accepted Date: 2019-09-20
  • Publish Date: 2020-01-01
  • In this study, lignin-based phenolic resin was modified with whisker silicon and preparation of the phenolic foam is carried out. The resin and foam materials were characterized by Fourier transform infrared spectroscopy (FT-IR), thermo gravimetric analyzer (TGA), thermal conductivity test, limit oxygen index (LOI) analyzer and cone calorimeter. The results showed that if the content of lignin and whisker silicon increases, the oxygen index of the foam increases and the calorific value of combustion decreases. However, if the amount of lignin increased, the open porosity of the foam and the thermal conductivity increased. When the lignin substitution rate was 30% and the whisker silicon addition amount was 1%, the phenolic foam (PF4) has the best performance:the 57.1% mass lost at 600℃ and the thermal stability was 16.8% higher than that of ordinary resin. The LOI was 49.6%, and 39.3% higher than that of ordinary phenolic foam.

     

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