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Lignin-based Phenolic Resin Modified with Whisker Silicon and its Ap-plication

  • Corresponding author: Lilong Hua, e-mail addresses:zhlh990907@sina.com
  • Received Date: 2019-07-10
    Accepted Date: 2019-09-20
    Fund Project:

    This research was supported by Key R&D Plan of the 13th Five-Year Plan (No. 2017YFD0601003), Key projects funded by the Chinese Academy of Forest (No. CAFYBB2018ZC004) and Innovation Project of Institute of Forestry and Chemical Industry (No. LHSXKQ11).

  • In this study, lignin-based phenolic resin was modified with whisker silicon and preparation of the phenolic foam is carried out. The resin and foam materials were characterized by Fourier transform infrared spectroscopy (FT-IR), thermo gravimetric analyzer (TGA), thermal conductivity test, limit oxygen index (LOI) analyzer and cone calorimeter. The results showed that if the content of lignin and whisker silicon increases, the oxygen index of the foam increases and the calorific value of combustion decreases. However, if the amount of lignin increased, the open porosity of the foam and the thermal conductivity increased. When the lignin substitution rate was 30% and the whisker silicon addition amount was 1%, the phenolic foam (PF4) has the best performance:the 57.1% mass lost at 600℃ and the thermal stability was 16.8% higher than that of ordinary resin. The LOI was 49.6%, and 39.3% higher than that of ordinary phenolic foam.
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Lignin-based Phenolic Resin Modified with Whisker Silicon and its Ap-plication

    Corresponding author: Lilong Hua, e-mail addresses:zhlh990907@sina.com
  • a Institute of Chemical Industry of Forest Products, Chinese Academy of Forest;Co-innovation Center of Efficient Processing and Utilization of Forest Resource, Nanjing Forestry University, Nanjing 210042, China;
  • b School of Petrochemical Engineering, Dalian University of Technology, Dalian 116024, Liaoning Province, China
Fund Project:  This research was supported by Key R&D Plan of the 13th Five-Year Plan (No. 2017YFD0601003), Key projects funded by the Chinese Academy of Forest (No. CAFYBB2018ZC004) and Innovation Project of Institute of Forestry and Chemical Industry (No. LHSXKQ11).

Abstract: In this study, lignin-based phenolic resin was modified with whisker silicon and preparation of the phenolic foam is carried out. The resin and foam materials were characterized by Fourier transform infrared spectroscopy (FT-IR), thermo gravimetric analyzer (TGA), thermal conductivity test, limit oxygen index (LOI) analyzer and cone calorimeter. The results showed that if the content of lignin and whisker silicon increases, the oxygen index of the foam increases and the calorific value of combustion decreases. However, if the amount of lignin increased, the open porosity of the foam and the thermal conductivity increased. When the lignin substitution rate was 30% and the whisker silicon addition amount was 1%, the phenolic foam (PF4) has the best performance:the 57.1% mass lost at 600℃ and the thermal stability was 16.8% higher than that of ordinary resin. The LOI was 49.6%, and 39.3% higher than that of ordinary phenolic foam.

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